Tim Eppinga

Senior Vice President Global Sales & Technology
Tim Eppinga - SVP Global Sales and Technology

Tim Eppinga

Senior Vice President Global Sales & Technology

Mr. Eppinga was promoted to Senior Vice President of Global Sales and Technology in 2020. In this role he leads Plastipak Packaging’s Global Sales Group and Technology Centers. These are customer-focused teams that are responsible for delivering new products that assist consumer brands to “Win on Shelf” and ensure those packages are sustainably balanced.

He started with Plastipak Packaging in 1990 as a Sales Representative in Chicago before moving into roles as Beverage Technical Service Manager, National Account Manager and District Sales Manager.

In 2000, Tim relocated to Plastipak’s Global Business and Technology Center where he held several Corporate Sales Management roles. He also serves as a core member of the Plastipak Concept to Market Team. This team identifies and prioritizes the consumer-first focused projects that they believe are the next transformational technologies for the rigid packaging industry.

Mr. Eppinga holds a BS degree as a Packaging Engineer from Michigan State University.

Tim Eppinga

Mr. Eppinga was promoted to Senior Vice President of Global Sales and Technology in 2020. In this role he leads Plastipak Packaging’s Global Sales Group and Technology Centers. These are customer-focused teams that are responsible for delivering new products that assist consumer brands to “Win on Shelf” and ensure those packages are sustainably balanced.

He started with Plastipak Packaging in 1990 as a Sales Representative in Chicago before moving into roles as Beverage Technical Service Manager, National Account Manager and District Sales Manager.

In 2000, Tim relocated to Plastipak’s Global Business and Technology Center where he held several Corporate Sales Management roles. He also serves as a core member of the Plastipak Concept to Market Team. This team identifies and prioritizes the consumer-first focused projects that they believe are the next transformational technologies for the rigid packaging industry.

Mr. Eppinga holds a BS degree as a Packaging Engineer from Michigan State University.